Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1980-09-30
1982-11-09
Edlow, Martin H.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 62, 427 63, 307306, H01L 3922
Patent
active
043587836
ABSTRACT:
This invention relates to granular metal and metal oxide superconducting films formed by ion beam sputter deposition. Illustratively, the films comprise irregularly shaped, randomly oriented, small lead grains interspersed in an insulating lead oxide matrix. The films are hillock-resistant when subjected to thermal cycling and exhibit unusual Josephson-type switching characteristics. Depending on the oxygen content, a film may behave in a manner similar to that of a plurality of series connected Josephson junctions, or the film may have a voltage difference in a direction parallel to a major surface of the film that is capable of being switched from zero voltage difference to a finite voltage difference in response to a current larger than the critical current.
REFERENCES:
patent: 4012756 (1977-03-01), Chaudhari
Hebard et al., Bull. of Am. Phys. Soc., vol. 24, No. 3, Mar. 1979, p. 357.
Lihiri, Appl. Phys. Lett., vol. 36, No. 4, Feb. 1980, pp. 334-336.
Kircher, Science, vol. 208, May 1980, pp. 944-950.
van der Drift, Philips Res. Reports, vol. 21, 1966, pp. 289-303.
Hansma et al., Journ. of Appl. Phys., vol. 45, No. 9, pp. 4016-4024, Sep. 1974.
Ronay, IBM Tech. Discl. Bull., vol. 22, No. 1, Jun. 1979, pp. 411-412.
Hebard Arthur F.
Vandenberg Joanna M.
Bell Telephone Laboratories Incorporated
Edlow Martin H.
Urbano Michael J.
LandOfFree
Superconducting thin films does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Superconducting thin films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Superconducting thin films will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-748264