Superconducting lead on integrated circuit

Details Superconducting lead on integrated circuit Superconducting lead on integrated circuit

1991-08-22

1994-02-01

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Superconductive contact or lead

On integrated circuit

257754, 257762, 505 1, 505700, 505703, 505704, H01L 3900, H01L 2348, H01B 1200

Patent

active

052834654

ABSTRACT:
An improved electric device utilizing a superconducting material. In order to avoid undesirable oxidation during firing of a ceramic to be superconducting material formed on the substrate, the superconducting material is provided only on the position in which the superconducting material does not contact the operational region of said semiconductor substrate.

REFERENCES:
patent: 4660061 (1987-04-01), Sweeny et al.
patent: 4673968 (1987-06-01), Hieber et al.
patent: 4707723 (1987-11-01), Okamoto et al.
patent: 4837609 (1989-06-01), Gurvitch et al.
patent: 4916508 (1990-04-01), Tsukamoto et al.
patent: 4952554 (1990-08-01), Jin et al.
Appl. Phys. Lett. 51(3), Jul. 20, 1987, "High T.sub.c superconductors-composite wire fabrication", by Jin et al., pp. 203, 204.
Japanese Journal of Applied Physics, vol. 26, No. 5, May, 1987, pp. L759-L760, "Critical Temperature and Critical Current Density of La-Sr-Cu-oxide Wires" by Kohno et al.

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