Superconducting bonds for thin film devices

Details Superconducting bonds for thin film devices Superconducting bonds for thin film devices

1992-03-03

1992-08-18

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228111, 228208, 22826319, 174 94R, 505927, H01L 21607, H01L 3900, B23K 2010

Patent

active

051391929

ABSTRACT:
A method of bonding a superconductive ribbon lead to a superconductive bonding pad connected to superconducting circuitry. The thin ribbon is first coated with a fresh layer of the same material from which it is made and then a very thin layer of a noble metal is applied over that fresh layer. The bonding pad is also prepared with a very thin layer of the noble metal. Those coated surfaces are placed in facing contact and ultrasonically bonded.

REFERENCES:
patent: 3346351 (1967-10-01), Flashman
patent: 4403189 (1983-09-01), Simmonds
patent: 5031822 (1991-07-01), Humpston et al.
patent: 5110034 (1992-05-01), Simmonds

Affiliated with

Also associated with

Rating

Superconducting bonds for thin film devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Superconducting bonds for thin film devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Superconducting bonds for thin film devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1242810