Metal fusion bonding – Process – Plural joints
Patent
1975-12-30
1977-11-22
Kelly, Donald G.
Metal fusion bonding
Process
Plural joints
228194, 228209, 228263, B23K 1900
Patent
active
040592170
ABSTRACT:
A liquid interface diffusion process is provided where a thin deposit (from 1/2 to 4 mils) of nickel (and/or cobalt) having 4-12 weight percent boron is plated on the nickel or cobalt based alloy faying surfaces. In the case of honeycomb sandwich, the plating is applied to the edge of the core or on the facing sheets and the assembly held together in intimate contact and exposed to a temperature sufficient to cause the Ni-B eutectic to melt. At the eutectic temperature a liquid is formed which makes a metallurgical joint. Upon further time at temperature the boron is diffused into the substrate so that isothermal solidification occurs and the boron is diluted to a small concentration. Sufficient time is allowed (on the order of one or more hours) so that the melting point at the joint area is essentially the same as the substrate and the joint is comparable to a diffusion bond.
In the case of solid sections the Ni(Co), 4-12% B plating is deposited on one faying surface or 1/2 the amount on both faying surfaces and exposed to the same conditions as described above.
REFERENCES:
patent: 3234031 (1966-02-01), Zirngiebl et al.
patent: 3530568 (1970-09-01), Owczarski et al.
patent: 3675311 (1972-07-01), Wells
patent: 3678570 (1972-07-01), Paulonis et al.
patent: 3723078 (1973-03-01), Parker
patent: 3769101 (1973-10-01), Woodward
Gilliam Frank D.
Kelly Donald G.
Ramsey K. J.
Rohr Industries, Incorporated
Schlesinger Patrick J.
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