Super-position cooling

Details Super-position cooling Super-position cooling

1990-04-18

1992-03-17

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 804, 16510433, 174 163, 361385, H05K 720

Patent

active

050973851

ABSTRACT:
A system and method of cooling which uses both jet impingement and conduction cooling. Conduction cooling is accomplished by placing a cluster of pistons in contact with each chip. The pistons have a rectangular foot at the bottom which contacts the chip. A dielectric coolant, such as liquid nitrogen or fluorocarbon is delivered at the center of each cluster, the fluid flows over the top of the feet, and in the channels between the feet, providing jet enhanced convective cooling at the lower portion of the pistons. Advantageously, the pistons serve as extended surfaces which increase the area over which the forced convection cooling occurs. In a preferred embodiment, microfins protruding from the header sections of each piston further increase the area for heat transfer. In addition, for non-boiling applications, grooves are added to the piston foot surface that contact the chip to insure wetting of the chip-piston interface. The upper portion of the pistons are also immersed in and therefore cooled by the dielectric coolant.

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