Sulfate-free method of etching copper pattern on printed circuit

Details Sulfate-free method of etching copper pattern on printed circuit Sulfate-free method of etching copper pattern on printed circuit

1978-07-17

1979-11-20

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

156 66, 252 793, C25D 502, C23F 102, C09K 1308

Patent

active

041750110

ABSTRACT:
In printed circuit board manufacture, a copper pattern on the board is slightly etched and then a tin/lead layer is plated onto the etched copper pattern. The etching step is free of sulfate materials and includes etching the copper pattern with an aqueous solution of hydrogen peroxide and fluoboric acid.

REFERENCES:
patent: 3181984 (1965-05-01), Tillis
patent: 3293093 (1966-12-01), Jones et al.
patent: 3554878 (1971-01-01), Rothschild
patent: 3677949 (1972-07-01), Brindisi, Jr. et al.
patent: 3859182 (1975-01-01), Vander Mey
patent: 3864271 (1975-02-01), Stalter

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