Suction pipette and method of manufacture for receiving of semic

Details Suction pipette and method of manufacture for receiving of semic Suction pipette and method of manufacture for receiving of semic

1976-10-13

1977-11-15

Smith, Al Lawrence

Metal fusion bonding

Process

Bonding nonmetals with metallic filler

228 441A, 228172, 75208R, 294205, 294 64R, H01L 2168, B22F 706

Patent

active

040582469

ABSTRACT:
A method of manufacturing a suction pipette of sinterable material for receiving substantially rectangular, semiconductor crystal plates. The pipette is formed with a rectangular recess and has walls defining the recess which narrow towards the floor of the recess; an evacuation channel communicates with the floor. The method includes the steps of inserting a binder into the material to be sintered, and fabricating first and second parts for assembly of the pipette, the first part being formed with an open channel and having sidewalls defining the channel. The second part is insertable into the first part and has cam-shaped end projections formed with respective inner walls, and outer walls for making contact with the sidewalls upon insertion of the second part into the first part. The method additionally includes grinding the sidewalls of the first part within the region of the open channel and the outer walls of the projections to a predetermined tapered angle for at least a first portion of the sidewalls, and the outer walls to fittingly abut each other, and heat treating the first and second parts upon insertion of the second part into the first part for uniting the first and second parts by diffusion of the binder within the sinterable material.

REFERENCES:
patent: 3429700 (1969-02-01), Wiegand et al.
patent: 3479716 (1969-11-01), Zanger, Jr.
patent: 3551991 (1971-01-01), Reich et al.
patent: 3591915 (1971-07-01), Roberts et al.
patent: 3695502 (1972-10-01), Gaiser

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