Substrates with dense metal vias produced as co-sintered and por

Details Substrates with dense metal vias produced as co-sintered and por Substrates with dense metal vias produced as co-sintered and por

1989-03-06

1991-04-30

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428141, 428209, 428402, 428403, 428432, 428901, 252514, 252518, 106 114, 106 115, 106 118, 106 119, 106 121, 156 89, B32B 300

Patent

active

050117254

ABSTRACT:
Dense metal vias in pure alumina substrates are derived from a metallization composition having 80-97% refractory metal, 2-15% alumina, 0.05-5% sintering aid, and 0-5% bonding additive; it has been found that for alumina contents greater than about 12%, a bonding additive is not required. The same compositions, absent the sintering aid, can be used to form bimetallic vias; these vias include a porous metal network where the pores are infiltrated with another metal, for example, porous tungsten infiltrated with copper.

REFERENCES:
patent: 4020234 (1977-04-01), Gardner
patent: 4207369 (1980-06-01), Kazmierowicz
patent: 4273822 (1981-06-01), Bube
patent: 4415624 (1983-11-01), Prabhu et al.
patent: 4617237 (1986-10-01), Gupta et al.
patent: 4733328 (1988-03-01), Blazej
patent: 4847003 (1989-07-01), Palanisamy

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