Substrates with dense metal vias

Details Substrates with dense metal vias Substrates with dense metal vias

1987-05-22

1989-08-29

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428209, 428210, 428426, 428432, 428901, 106 112, 106 127, 252515, 252518, 73245, B32B 310, B22F 700, H01B 102

Patent

active

048616419

ABSTRACT:
Dense vias may be made with a metallizing composition containing tungsten, alumina, and either nickel or palladium. Further, an infiltration process ensures that vias in ceramic substrates are heremetic. Infiltrating materials, including metals and alloys, are applied to co-fired substrates and the composite is fired. The process may be repeated if necessary. Alternatively, the via holes may be bore-coated prior to infiltrating.

REFERENCES:
patent: 3537888 (1970-11-01), Schwyn
patent: 3637435 (1972-01-01), Schwyn et al.
patent: 4289719 (1981-09-01), McIntosh et al.
patent: 4340618 (1982-07-01), Fury et al.
patent: 4464420 (1984-08-01), Taguchi et al.
patent: 4485150 (1984-11-01), Tsuno
patent: 4684446 (1987-08-01), Charles et al.

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