Substrates used in multilayered integrated circuits and multichi

Details Substrates used in multilayered integrated circuits and multichi Substrates used in multilayered integrated circuits and multichi

1992-03-30

1994-03-08

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4271265, 427278, 427365, 4273762, 4274192, B05D 512

Patent

active

052925480

ABSTRACT:
A method for making a substrate for use in a multilayered integrated circuit or multichip module which includes coating a conductive material on a surface of a support sheet to form a conductive circuit and then drying the sheet. Next, a coating of a layer of dielectric layer is placed on the support surface in the areas where the conductive material is not cast. After which the coated sheet is densified to form a densified conductive circuit embedded dielectric layer. A second coating of a dielectric is placed over the first densified conductive circuit embedded dielectric layer such that the second layer is characterized by vias therein which are in register with at least a portion of the conductive circuit. The vias in the second dielectric layer are filled to form electrically conductive vias and then densifying to form the substrate.

REFERENCES:
patent: 4586972 (1986-05-01), Yokotani et al.
patent: 4645552 (1987-02-01), Vitriol et al.

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