Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-06-26
2007-06-26
Louie, Wai-Sing (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S022000, C438S024000, C438S046000, C438S047000, C438S540000
Reexamination Certificate
active
10812035
ABSTRACT:
Substrates having increased thermal conductivity are provided, comprising a body having opposed surfaces and a cavity that opens on at least one surface, the cavity containing at least one material having a greater thermal conductivity than the body. Devices are provided comprising a substrate and a semiconductor over a surface of the substrate. Methods of forming devices according to the invention are also provided.
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Kneissl Michael A.
Northrup John E.
Romano Linda T.
Louie Wai-Sing
Xerox Corporation
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