Substrates having increased thermal conductivity for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

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C438S022000, C438S024000, C438S046000, C438S047000, C438S540000

Reexamination Certificate

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10812035

ABSTRACT:
Substrates having increased thermal conductivity are provided, comprising a body having opposed surfaces and a cavity that opens on at least one surface, the cavity containing at least one material having a greater thermal conductivity than the body. Devices are provided comprising a substrate and a semiconductor over a surface of the substrate. Methods of forming devices according to the invention are also provided.

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patent: 6593159 (2003-07-01), Hashimoto et al.
CRC Handbook of chemistry and physics, 82nd Ed, by David Lide.
F. A. Ponce et al., “Nitride-based semiconductors for blue and green light-emitting devices,”Nature,vol. 386, pp. 351-358, Mar. 1997.

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