Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2005-08-16
2005-08-16
Thompson, Craig A. (Department: 2813)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
Reexamination Certificate
active
06930055
ABSTRACT:
The described embodiments relate to substrates having features formed therein and methods of forming same. One exemplary method forms a blind feature through a majority of a thickness of a substrate, the blind feature being defined by at least one sidewall surface and a bottom surface. The method also applies an etch resistant material to the blind feature and removes the etch resistant material from at least a portion of the bottom surface. The method further wet etches the substrate at least through the bottom surface sufficient to form a through feature through the thickness of the substrate.
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Bhowmik Siddhartha
Huth Mark C.
Knuth Rocky H.
Rivas Rio T.
Harrison Monica D.
Hewlett--Packard Development Company, L.P.
Thompson Craig A.
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