Substrates for powder deposition containing conductive domains

Details Substrates for powder deposition containing conductive domains Substrates for powder deposition containing conductive domains

2005-01-18

2005-01-18

Watkins, III, William P. (Department: 1772)

Stock material or miscellaneous articles

Structurally defined web or sheet

Continuous and nonuniform or irregular surface on layer or...

C428S138000, C118S624000, C118S625000, C427S458000, C427S468000, C427S469000, C427S475000, C427S002140, C424S489000, C424S443000, C424S451000

Reexamination Certificate

active

06844048

ABSTRACT:
Provided is, among other things, a conductive inlay film comprising: a layer of dielectric film having a pattern of holes suitable to define selected regions to which particles will be deposited by electrostatic deposition; and a conductive element comprising polymer, which element comprises (a) a conductive film laminated against the dielectric film or (b) a conductive film embedded within the holes, the portion of the conductive element appearing within the holes comprising conductive inlays, wherein the conductive element is adapted to contact one or more electrode pads and provide electrical potentials at the selected regions, and wherein the dielectric film electrically isolates the selected regions.

REFERENCES:
patent: 4231660 (1980-11-01), Remy et al.
patent: 5558928 (1996-09-01), DiStefano et al.
patent: 5669973 (1997-09-01), Pletcher
patent: 6007630 (1999-12-01), Pletcher et al.
patent: 6146685 (2000-11-01), Chrai et al.
patent: 6303143 (2001-10-01), Chrai et al.
patent: 6319541 (2001-11-01), Pletcher et al.
patent: 6380060 (2002-04-01), Zohni
patent: 6399143 (2002-06-01), Sun et al.
patent: 6428809 (2002-08-01), Abrams et al.
International search report from International Application No. PCT/US01/41339, mailed Nov. 16, 2001.

Affiliated with

Also associated with

Rating

Substrates for powder deposition containing conductive domains does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrates for powder deposition containing conductive domains, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrates for powder deposition containing conductive domains will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3378285