Substrates for optical cards, process for preparing substrates f

Dynamic information storage or retrieval – Specific detail of information handling portion of system – Radiation beam modification of or by storage medium

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

3692751, 264 13, 264106, B29C 4700

Patent

active

052672280

ABSTRACT:
A substrate for an optical card having tracking grooves in a stripe form formed on the surface of an extrusion-molded thermoplastic resin sheet is characterized in that the direction of the tracking grooves is in parallel to the extrusion direction of the thermoplastic resin sheet, and the recording or reproduction using the optical card is characterized by that the optical card is bent and reciprocally moved along the direction of tracking grooves.

REFERENCES:
patent: 4798694 (1989-01-01), Sugata et al.
patent: 4836874 (1989-06-01), Foster
patent: 4840821 (1989-06-01), Miyazaki et al.
patent: 4860273 (1989-08-01), Sawano et al.
patent: 4944967 (1990-07-01), Yabe et al.
patent: 4991541 (1991-02-01), Sugata et al.
patent: 5048745 (1991-09-01), Sato et al.
patent: 5075060 (1991-12-01), Imataki
patent: 5137661 (1992-08-01), Kanome et al.
Patent Abstracts of Japan, vol. 12, No. 497 (P-806), Dec. 26, 1988; & JP-A-63 205 855 (Canon Inc.) Aug. 25, 1988, Abstract.
Patent Abstracts of Japan, vol. 12, No. 23 (P-658), Jan. 23, 1988; & JP-A-62 177 747 (Canon Inc.) Aug. 4, 1987, Abstract.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Substrates for optical cards, process for preparing substrates f does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrates for optical cards, process for preparing substrates f, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrates for optical cards, process for preparing substrates f will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2103194

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.