Substrate with optical communication systems between chips mount

Optical waveguides – Integrated optical circuit

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

G02B 610, G02B 514

Patent

active

051597004

ABSTRACT:
A circuit composed of a circuit board of crystalline elemental silicon slice and circuit components in the form of semiconductor integrated circuits therein which are preferably formed of a Group III-V compound. Signals from each of the integrated circuits are transmitted to other integrated circuits on the board or externally of the board either by conventional printed conductors on the board or by a laser formed in each integrated circuit at each output terminal thereon which transmits light signals along light transmitting members in the silicon board to detectors at the input locations on other ones of the integrated circuits on the board for external to the board. The light signal is transferred from an integrated circuit output to an integrated circuit input or to a device external to the board by means of light transmitting members. These light transmitting members may be light conducting waveguides positioned either on the surface of the board or in grooves formed therein. Alternatively, the light transmitting members can be silicon dioxide paths formed in the silicon circuit board by selective oxidation of the silicon board to form silicon dioxide light transmitting paths therein. Each light transmitting path is coupled between a light emitting output from an integrated circuit and a light receiving input of another integrated circuit on the same or a different semiconductor chip or travels to the edge of the circuit board for transmission external of the board.

REFERENCES:
patent: 3879606 (1975-04-01), Bean
patent: 3948583 (1976-04-01), Tien
patent: 4585299 (1986-04-01), Strain
patent: 4652077 (1987-03-01), Erman et al.
patent: 4652290 (1987-03-01), Cho et al.
patent: 4693543 (1987-09-01), Matsumura et al.
patent: 4762382 (1988-08-01), Husain et al.
patent: 5009476 (1991-04-01), Ried et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Substrate with optical communication systems between chips mount does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate with optical communication systems between chips mount, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate with optical communication systems between chips mount will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-912416

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.