Substrate with micro-via structures by laser technique

Details Substrate with micro-via structures by laser technique Substrate with micro-via structures by laser technique

2007-11-20

2007-11-20

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S266000, C156S922000

Reexamination Certificate

active

11015683

ABSTRACT:
A substrate to which a laser technique is applied includes a signal layer, a micro via structure, and a differential signal pair. The micro via structure is divided into a first conductive column and a second conductive column after a laser-cutting step. The first conductive column includes a first flat conductive layer, and the second conductive column includes a second flat conductive layer. A first trace of the differential signal pair is parallel to and electrically connected to the first flat conductive layer. A second trace of the differential signal pair is parallel to and electrically connected to the second flat conductive layer. The distance between the first trace and the second trace is the same as the distance between the first flat conductive layer and the second flat conductive layer. The reflection of high-speed signals and the noise interferences can be reduced.

REFERENCES:
patent: 4931134 (1990-06-01), Hatkevitz et al.
patent: 6137064 (2000-10-01), Kiani et al.
patent: 6201194 (2001-03-01), Lauffer et al.

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