Substrate with many via contact means disposed therein

Details Substrate with many via contact means disposed therein Substrate with many via contact means disposed therein

2007-11-06

2007-11-06

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S702000, C257S779000, C257SE23146

Reexamination Certificate

active

11207715

ABSTRACT:
A substrate having many via contact means disposed therein. Each of the via contact means is composed of a via hole, as a through-hole, formed in the substrate, a metal film disposed on the inner peripheral surface of the via hole, and a solder filled into the cavity defined by the metal film.

REFERENCES:
patent: 5972734 (1999-10-01), Carichner et al.
patent: 7024763 (2006-04-01), Mathieu et al.
patent: 2002/0157247 (2002-10-01), Li
patent: 2004/0173891 (2004-09-01), Imai et al.
patent: 2002-174742 (2002-06-01), None
“Chip on Board for Multichip Modules” by John H. Lau, Published by Chapman and Hall, NY, 1994.

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