Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having substrate registration feature
Reexamination Certificate
2008-08-08
2010-06-01
Thai, Luan C (Department: 2891)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Having substrate registration feature
C438S975000, C438S462000, C257S797000, C257SE23179
Reexamination Certificate
active
07727852
ABSTRACT:
The invention relates to a substrate with a check mark and a method of inspecting position accuracy of conductive glue dispensed on the substrate. The method is implemented on the substrate having at least one transfer pad and at least one check mark arranged near the border of the transfer pad. After the conductive glue spot is dispensed on the transfer pad, the method includes first capturing an image by a video capturing element, then determining whether the conductive glue spot exist in the image and determining whether the conductive glue spot from the image matches a predetermined standard, if not, generating a report and a warning.
REFERENCES:
patent: 6992735 (2006-01-01), Kim
patent: 7264994 (2007-09-01), Noda
patent: 7264997 (2007-09-01), Kameyama et al.
patent: 2007/0052344 (2007-03-01), Wen et al.
patent: 2007/0190747 (2007-08-01), Humpston et al.
patent: 100381918 (2008-04-01), None
English language translation of abstract and pertinent parts of CN 100381918.
AU Optronics Corporation
Thai Luan C
Thomas Kayden Horstemeyer & Risley
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