Substrate wiring patterns for connecting to integrated-circuit c

Details Substrate wiring patterns for connecting to integrated-circuit c Substrate wiring patterns for connecting to integrated-circuit c

1982-12-30

1985-01-22

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361406, 361409, H05K 102

Patent

active

044953771

ABSTRACT:
An IC chip connects to a substrate by a pattern of pads arranged in single lines along the radial edges of segments of a polygon underlying the chip-linear conductors from the pads cross the outer edge of the segments in parallel groups. Wider power conductors can also be placed in the pattern.

REFERENCES:
patent: 3716761 (1973-02-01), Rotast
patent: 3833838 (1974-09-01), Christiansen
patent: 4195195 (1980-03-01), Miranda et al.
Milliken et al., Electrode Pattern, IBM Tech. Disc. Bull., V. 11 #7, Dec. 1968, p. 850.
Balyoz et al., Densified Wiring Channels Design Concept, IBM Tech. Disc. Bull., V. 17 #7, Dec. 1974, pp. 1958 and 1959.

Affiliated with

Also associated with

Rating

Substrate wiring patterns for connecting to integrated-circuit c does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate wiring patterns for connecting to integrated-circuit c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate wiring patterns for connecting to integrated-circuit c will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-567894