Substrate used for fabrication of thick film circuit

Details Substrate used for fabrication of thick film circuit Substrate used for fabrication of thick film circuit

1990-05-18

1992-02-11

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428209, 428210, 428220, 428432, 428697, 428698, 428901, 156 89, 361397, B32B 300

Patent

active

050875094

ABSTRACT:
An insulating substrate is used for fabrication of a thick film circuit provided with a conductive pattern made from a paste containing glass frits, and comprises a foundation containing an aluminum nitride and incidental impurities, and a multi-level surface film structure provided between the foundation and the conductive pattern and having a lower surface film of an aluminum oxide provided on a surface of the foundation, an intermediate surface film provided on the lower surface film and formed of a substance having a relatively small acidity and an upper surface film provided on the intermediate surface film and formed of a substance having a relatively large acidity, in which the substance with the large acidity rapidly reacts with the frits in a firing stage for enhancing the adhesion of the conductive pattern but the substance with the relatively small acidity restricts the consumption thereof, so that the total thickness of the multi-level film structure is decrased and, accordingly, the heat radiation capability is improved.

REFERENCES:
patent: 4517584 (1985-05-01), Matsushita
patent: 4536435 (1985-08-01), Utsumi
patent: 4556599 (1985-12-01), Sato
patent: 4582745 (1986-04-01), Schnable
patent: 4591537 (1986-05-01), Aldinger
patent: 4659611 (1987-04-01), Iwase
patent: 4810563 (1989-03-01), DeGree
patent: 4908348 (1990-03-01), Hung
patent: 4950588 (1990-08-01), Sarin

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