Cleaning and liquid contact with solids – Apparatus – With plural means for supplying or applying different fluids...
Reexamination Certificate
2009-03-04
2009-10-13
Markoff, Alexander (Department: 1792)
Cleaning and liquid contact with solids
Apparatus
With plural means for supplying or applying different fluids...
C134S102100
Reexamination Certificate
active
07600522
ABSTRACT:
A substrate treatment method including the steps of: generating droplets of a treatment liquid by mixing the treatment liquid with a gas; and causing the treatment liquid droplets generated in the liquid droplet generating step to impinge on a surface of a substrate being treated. The treatment liquid droplets have a volume median diameter of 5 μm to 40 μm.
REFERENCES:
patent: 3296015 (1967-01-01), Juvinall et al.
patent: 5918817 (1999-07-01), Kanno et al.
patent: 5934566 (1999-08-01), Kanno et al.
patent: 6997405 (2006-02-01), Haruch
patent: 2002/0059947 (2002-05-01), Sato et al.
patent: 2003/0141383 (2003-07-01), Hayashi
patent: 2003/0170988 (2003-09-01), Izumi et al.
patent: 56-115538 (1981-09-01), None
patent: 63-54982 (1988-03-01), None
patent: 2-288230 (1990-11-01), None
patent: 3-186369 (1991-08-01), None
patent: 4-21551 (1992-04-01), None
patent: 4-322731 (1992-11-01), None
patent: 8-318181 (1996-12-01), None
patent: 10-197145 (1998-07-01), None
patent: 2000-254554 (2000-09-01), None
patent: 2001-137747 (2001-05-01), None
patent: 2002-224592 (2002-08-01), None
patent: 2002-270564 (2002-09-01), None
patent: 2003-7663 (2003-01-01), None
patent: 2003-22993 (2003-01-01), None
patent: 2003-022994 (2003-01-01), None
patent: 2003-501257 (2003-01-01), None
patent: 2003-59887 (2003-02-01), None
patent: 1999-013348 (1999-02-01), None
patent: WO 00/76673 (2000-12-01), None
patent: WO 01/49260 (2001-07-01), None
Written Opposition issued Dec. 12, 2006 in connection with the Korean Patent Application No. 10-2004-0011748 (Patent No. 602894).
Office Action issued Jun. 26, 2008 in connection with Japanese Patent Application No. 2003-145267.
Japanese Office Action issued Aug. 21, 2008 in connection with Japanese Application No. 2003-1581248.
Japanese Office Action issued Jan. 22, 2009 in connection with Japanese Application No. 2003-145627.
Hirae Sadao
Sato Masanobu
Yasuda Shuichi
Blan Nicole
Dainippon Screen Mfg. Co,. Ltd.
Markoff Alexander
Ostrolenk Faber LLP
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