Substrate treatment method and substrate treatment apparatus

Details Substrate treatment method and substrate treatment apparatus Substrate treatment method and substrate treatment apparatus

2006-08-22

2006-08-22

Koch, George (Department: 1734)

Coating processes

Measuring, testing, or indicating

Thickness or uniformity of thickness determined

C427S240000, C118S698000, C118S702000, C118S703000, C118S704000

Reexamination Certificate

active

07094440

ABSTRACT:
The present invention is a substrate treatment method in which a treatment by supplying a treatment solution from a nozzle to a substrate is successively performed for a plurality of substrates, which comprises the step of, during the performance of the successive treatments, performing between the treatments a plurality of pre-dispenses for different purposes of the treatment solution, wherein at least a recipe of the treatment solution to be pre-dispensed or a start condition of the pre-dispense is determined for each of the pre-dispenses. According to the present invention, the pre-dispense can be performed at a necessary and sufficient frequency to shorten the suspension time due to the pre-dispenses in the substrate treatment. This improves the throughput and reduces the number of pre-dispenses, resulting in reduced consumption of the treatment solution.

REFERENCES:
patent: 5089305 (1992-02-01), Ushijima et al.
patent: 6541063 (2003-04-01), Prentice et al.
patent: 09-320958 (1997-12-01), None
patent: 10-032157 (1998-02-01), None
patent: 2000-195774 (2000-07-01), None
Notification of Reason for Refusal, Dispatch No.: 144414, Dispatch Date: Apr. 26, 2005.

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