Substrate treatment method and substrate treatment apparatus

Details Substrate treatment method and substrate treatment apparatus Substrate treatment method and substrate treatment apparatus

2006-03-28

2006-03-28

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Nongaseous phase etching of substrate

Projecting etchant against a moving substrate or controlling...

C118S730000, C156S345550

Reexamination Certificate

active

07018555

ABSTRACT:
A substrate treatment method for treating a substrate by supplying a treatment liquid to the substrate while rotating the substrate. The method comprises the steps of: performing a first substrate rotation process for rotating the substrate while clamping the substrate by a first clamping member set; performing a second substrate rotation process after the first substrate rotation step for rotating the substrate while clamping the substrate by the first clamping member set and a second clamping member set provided separately from the first clamping member set; and performing a third substrate rotation process after the second substrate rotation step by unclamping the substrate from the first clamping member set for rotating the substrate while clamping the substrate by the second clamping member set.

REFERENCES:
patent: 6683007 (2004-01-01), Yamasaki et al.
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patent: 9-107023 (1997-04-01), None
patent: 10249613 (1998-09-01), None
patent: 2003088793 (2003-03-01), None

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