Substrate treatment method

Details Substrate treatment method Substrate treatment method

1997-07-10

2000-05-30

Utech, Benjamin L.

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

216 41, 438705, 438750, B08B 600, H01L 21302

Patent

active

060680008

ABSTRACT:
The present invention provides a substrate treatment method to be performed after the steps of forming a desired resist pattern on a substrate and etching thereof, wherein said method comprises steps of: (I) removing the resist pattern on the substrate using a remover solution principally containing a salt derived from hydrofluoric acid and a metal-free base; (II) rinsing said substrate with a lithographic rinsing solution containing a water-soluble organic solvent and water; and (III) washing said substrate with water. According to the present invention, metallic films on the substrate are not corroded in the substrate treatment method, and the method can be performed at a low cost and with a reduced volume of labor for disposal of waste solution used for washing the substrate.

REFERENCES:
patent: 4165295 (1979-08-01), Vandermay
patent: 4824762 (1989-04-01), Kobayashi et al.
patent: 5320709 (1994-06-01), Bowden et al.
patent: 5376236 (1994-12-01), Hanson et al.
patent: 5478436 (1995-12-01), Winebarger et al.
patent: 5571447 (1996-11-01), Ward
patent: 5698503 (1997-12-01), Ward et al.
patent: 5792274 (1998-08-01), Tanabe et al.
patent: 5795702 (1998-08-01), Tanabe et al.

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