Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2003-07-31
2009-02-24
Markoff, Alexander (Department: 1792)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S030000, C134S036000, C134S094100, C134S095300, C134S102200, C134S103200, C134S902000
Reexamination Certificate
active
07494549
ABSTRACT:
A substrate treatment apparatus for removing an unnecessary substance from a surface of a substrate. The apparatus is provided with: an oxidation liquid supply mechanism for supplying an oxidation liquid having an oxidative effect to the substrate surface; a physical cleaning mechanism for physically cleaning the substrate surface; and an etching liquid supply mechanism for supplying an etching liquid having an etching effect to the substrate surface. It is preferred to physically clean the substrate surface while supplying the oxidation liquid to the substrate surface.
REFERENCES:
patent: 5487398 (1996-01-01), Ohmi et al.
patent: 6431185 (2002-08-01), Tomita et al.
patent: 2001/0042559 (2001-11-01), Mertens et al.
patent: 2002/0005214 (2002-01-01), Tomita et al.
patent: 2002/0035762 (2002-03-01), Okuda et al.
patent: 2002/0059947 (2002-05-01), Sato et al.
patent: 6-5580 (1994-01-01), None
patent: 06-314679 (1994-11-01), None
patent: 8-155408 (1996-06-01), None
patent: 10-270403 (1998-10-01), None
patent: 11-260778 (1999-09-01), None
patent: 11-260779 (1999-09-01), None
patent: 2002-113429 (2002-04-01), None
Dainippon Screen Mfg. Co,. Ltd.
Markoff Alexander
Ostrolenk Faber Gerb & Soffen, LLP
LandOfFree
Substrate treatment apparatus and substrate treatment method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate treatment apparatus and substrate treatment method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate treatment apparatus and substrate treatment method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4081949