Substrate treatment apparatus and substrate treatment method

Details Substrate treatment apparatus and substrate treatment method Substrate treatment apparatus and substrate treatment method

2011-03-29

2011-03-29

Chin, Randall (Department: 3723)

Brushing, scrubbing, and general cleaning

Machines

Brushing

C015S088200, C015S102000

Reexamination Certificate

active

07913346

ABSTRACT:
A substrate treatment apparatus includes a substrate holding mechanism which holds a substrate, a scrub brush for scrubbing a surface of the substrate held by the substrate holding mechanism to remove foreign matter from the substrate surface, a treatment liquid supplying mechanism which supplies an alkaline treatment liquid to the substrate surface when the substrate is scrubbed with the scrub brush, and an alkaline fluid supplying mechanism which supplies an alkaline fluid to a surface of the scrub brush in a standby period during which no substrate is scrubbed with the scrub brush.

REFERENCES:
patent: 5647083 (1997-07-01), Sugimoto et al.
patent: 5693148 (1997-12-01), Simmons et al.
patent: 6175983 (2001-01-01), Hirose et al.
patent: 7-283192 (1995-10-01), None
patent: 8-321481 (1996-12-01), None
patent: 10-256206 (1998-09-01), None
patent: 11-135469 (1999-05-01), None
patent: 2000-208462 (2000-07-01), None
patent: 2000-208466 (2000-07-01), None
patent: 2003-332287 (2003-11-01), None
Korean Office Action was issued on Mar. 22, 2007 in connection with the Korean Patent Application No. 10-2006-0026379.
Japanese Office Action issued Jan. 7, 2010 in connection with corresponding Japanese Patent Application No. 2005-099367.
Japanese Office Action issued Apr. 1, 2010 in connection with corresponding Japanese Patent Application No. 2005-099368 (JP11-135469 was previously submitted in an IDS filed Feb. 8, 2010 and is therefore not enclosed.).

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