Substrate treating method and substrate treating apparatus

Details Substrate treating method and substrate treating apparatus Substrate treating method and substrate treating apparatus

2006-07-11

2006-07-11

Chen, Kin-Chan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C134S002000, C430S329000

Reexamination Certificate

active

07074726

ABSTRACT:
In a substrate treating unit, a removal liquid supplying mechanism supplies a removal liquid to the surface of a substrate. In order to retain the removal liquid on the surface of the substrate for a fixed time, a spin chuck is operated to spin the substrate at such a low speed as to retain the removal liquid on the substrate, or spins the substrate intermittently, or temporarily stops spinning of the substrate. Thus, treatment with the removal liquid progresses without a further supply of the removal liquid, thereby restraining consumption of the removal liquid.

REFERENCES:
patent: 6000862 (1999-12-01), Okuda et al.
patent: 6334229 (2002-01-01), Moinpour et al.
patent: 6432622 (2002-08-01), Moon et al.
patent: 6458518 (2002-10-01), Moon et al.
patent: 6502271 (2003-01-01), Epshteyn
patent: 6632289 (2003-10-01), Masui et al.
patent: 2002/0127500 (2002-09-01), Moon et al.
patent: 5-119482 (1993-05-01), None
patent: 9-199410 (1997-07-01), None
patent: 11-87226 (1999-03-01), None

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