Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – For liquid etchant
Reexamination Certificate
2006-09-12
2006-09-12
Hassanzadel, Parviz (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
For liquid etchant
C156S345170, C156S345210
Reexamination Certificate
active
07105074
ABSTRACT:
A substrate treating apparatus is provided for eliminating wasteful consumption of a treating solution in a treating mode in which the treating solution is delivered in a strip form to a substrate from a treating solution delivery nozzle sweeping over the substrate. In a first aspect of the invention, collecting vessels are arranged around a developing cup surrounding a wafer supported by a wafer holder. The collecting vessels collect part of a developer delivered from a discharge opening of a developer delivery nozzle outwardly of a surface of the wafer. In a second aspect of the invention, collecting vessels are arranged below a developer delivery nozzle, with collecting openings of the collecting vessels opposed to a discharge opening or openings of the delivery nozzle. The collecting vessels are moved longitudinally of the discharge openings according to a position of the developer delivery nozzle relative to the wafer.
REFERENCES:
patent: 5608943 (1997-03-01), Konishi et al.
patent: 5871584 (1999-02-01), Tateyama et al.
patent: 5985357 (1999-11-01), Sanada
patent: 6447608 (2002-09-01), Sakai et al.
patent: 11-221511 (1999-08-01), None
English Translation of JP 11-221511 taken from www4.ipdl.jpo.go.jp.
Aoki Kaoru
Kodama Mitsumasa
Matsunaga Minobu
Mitsuhashi Tsuyoshi
Nagao Takashi
Dainippon Screen Mfg. Co,. Ltd.
Hassanzadel Parviz
MacArthur Sylvia R.
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