Substrate treating method and apparatus

Details Substrate treating method and apparatus Substrate treating method and apparatus

1998-09-08

1999-10-05

Bell, Janyce

Coating processes

Centrifugal force utilized

118 52, 118320, 118321, 134 33, 1341042, 134172, 134198, 4273855, 437231, B05D 312, B05C 1102, B08B 700

Patent

active

059620706

ABSTRACT:
A substrate treating method and apparatus for treating a substrate by supplying a developing solution thereto while spinning the substrate. A nozzle having a plurality of discharge openings for discharging the developer is disposed such that the discharge openings are at different distances from the spin center of the substrate. The developer is discharged from the nozzle while the latter is moved radially of the substrate. The discharge openings then describe loci not overlapping one another over the substrate. The developer is evenly supplied over the substrate to promote the uniformity of development on the substrate surface.

REFERENCES:
patent: 5427820 (1995-06-01), Biche et al.
patent: 5571560 (1996-11-01), Lin
patent: 5695817 (1997-12-01), Tateyama et al.

Affiliated with

Also associated with

Rating

Substrate treating method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate treating method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate treating method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1168934