Substrate treating apparatus

Details Substrate treating apparatus Substrate treating apparatus

1994-03-17

1996-01-23

Roberts, Jr., Edward L.

Brushing, scrubbing, and general cleaning

Machines

Brushing

15 882, 134902, H01L 21304, B08B 1102, A46B 1304

Patent

active

054856442

ABSTRACT:
A substrate treatment apparatus includes a loader 1 for soaking a plurality of wafers W in deionized water, a back surface cleaning portion 2, a front surface cleaning portion 3, a rinsing and drying unit 4 and a plurality of transporting units 6. The back surface cleaning unit 2 cleans the back surface of the wafer W with a brush from the lower side by supplying deionized water to the wafer W that is removed from the loader 1. The front surface cleaning unit 3 cleans the upper surface of the wafer W with a brush by supplying deionized water to the wafer W cleaned by the back surface cleaning unit 2. The rinsing and drying unit 4 rinses the cleaned wafer W and then dries it. There is a transporting unit 6 disposed between the loader 1 and the back surface cleaning unit 2, another unit 6 is disposed between unit 2 and the upper surface cleaning unit 3, and another unit 6 is disposed between unit 3 and the rinsing and drying unit 4 while each of these three transporting units 6 transports the wafer W, deionized water is supplied to the wafer W to prevent being dried during the cleaning treatment.

REFERENCES:
patent: 4282825 (1981-08-01), Nagatumo et al.
patent: 4924890 (1990-05-01), Giles et al.
patent: 4935981 (1990-06-01), Ohtani et al.
patent: 4955402 (1990-09-01), Miranda
patent: 5092011 (1992-03-01), Gommori
patent: 5213118 (1993-05-01), Kamikawa
patent: 5351360 (1994-10-01), Suzuki et al.

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