Material or article handling – Device for emptying portable receptacle – Nongravity type
Patent
1995-05-31
1997-07-08
Keenan, James W.
Material or article handling
Device for emptying portable receptacle
Nongravity type
414936, 414937, 901 46, B65G 4907
Patent
active
056453914
ABSTRACT:
In a vertical heat treatment apparatus, a transfer apparatus is used to transfer a wafer between a wafer carrier and a wafer boat. The transfer apparatus comprises a base unit, a fork, three non-contact type sensors, and a main controller. The base unit can move between a first position at which to transfer the wafer to and from the wafer carrier and a second position at which to transfer the wafer to and from the wafer boat. The fork can move back and forth with respect to the base unit, for supporting the wafer. The non-contact type sensors are mounted on the fork, for detecting the position of the wafer. The main controller controls the base unit and the fork in accordance with the data detected by the non-contact type sensors.
REFERENCES:
patent: 4458152 (1984-07-01), Bonora
patent: 4718023 (1988-01-01), Arora
patent: 4744709 (1988-05-01), Hertel et al.
patent: 4770590 (1988-09-01), Hugues et al.
patent: 4836733 (1989-06-01), Hertel et al.
patent: 4941800 (1990-07-01), Koike et al.
patent: 5017082 (1991-05-01), Kobayashi
patent: 5044752 (1991-09-01), Thurfjell et al.
patent: 5133635 (1992-07-01), Malin et al.
patent: 5350269 (1994-09-01), Azuma et al.
patent: 5405230 (1995-04-01), Ono et al.
Ohsawa Tetu
Tateyama Kiyohisa
Keenan James W.
Tokyo Electron Limited
Tokyo Electron Tohoku Limited
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