Substrate transfer apparatus

Details Substrate transfer apparatus Substrate transfer apparatus

1998-12-28

2000-07-18

Kramer, Dean J.

Handling: hand and hoist-line implements

Contact lens applicator

4147445, 901 27, H01L 2168, B25J 1800, B25J 1900

Patent

active

060896302

ABSTRACT:
A arm 4 or 104 comprises a heat conduction suppressing portion such as cut-out grooves 8 or a low-temperature melting substance which suppresses conduction of heat. The heat conduction suppressing portion is disposed between a tip end portion of a front end arm 4 or 104 coupled to a mounting member 5 for a wafer W, and a basal portion of the front end arm 4 or 104. The substrate transfer apparatus according to the present invention can accurately transfer a substrate such as a semiconductor wafer for a long term while suppressing an influence of heat from a film growth apparatus or the like, to a level as low as possible.

REFERENCES:
patent: 4584045 (1986-04-01), Richards
patent: 5489192 (1996-02-01), Taniguchi
patent: 5584647 (1996-12-01), Uehara et al.
patent: 5700046 (1997-12-01), Doren et al.
patent: 5702228 (1997-12-01), Tamai et al.
patent: 5733096 (1998-03-01), Doren et al.
patent: 5934856 (1999-08-01), Asakawa et al.
patent: 5950495 (1999-09-01), Orgawa et al.

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