Substrate to substrate standoff assembly

Details Substrate to substrate standoff assembly Substrate to substrate standoff assembly

1993-05-21

1994-09-06

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361784, 361825, 174138G, 174166S, 439 55, H01R 2368

Patent

active

053453662

ABSTRACT:
A substrate to substrate interconnect and standoff assembly (10) comprises an electronic coupling (39) between the bottom of a first substrate (14) and the bottom of a second substrate (12), an electronic coupling (24) of the top of the first substrate to the bottom of the second substrate, a stand-off (20) between the first substrate and the second substrate, and a mechanical coupling (16) between the first substrate to the second substrate.

REFERENCES:
patent: 3596138 (1971-07-01), Lehrfeld
patent: 5172303 (1992-12-01), Bernardoni et al.

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