Substrate to heatsink interface apparatus and method

Details Substrate to heatsink interface apparatus and method Substrate to heatsink interface apparatus and method

1991-11-14

1992-09-15

Flanigan, Allen J.

Heat exchange

Heat transmitter

361386, 361387, 29890035, 174 163, F28F 700

Patent

active

051469812

ABSTRACT:
A cooling apparatus for a substrate with heat generating circuit devices mounted on a first side thereof. A second side of the substrate is coated with a first layer made of a releasing agent. A second layer made of a thermally conductive material having a low melting point is provided on the first layer. A heat sink is provided on the second layer, for radiating heat transmitted from the circuit device through the substrate, the first layer and the second layer. During the assembly, the apparatus is heated and compressed to reflow the second layer reducing any air pocket formed at the substrate-to-heatsink interface.

REFERENCES:
patent: 3405323 (1968-10-01), Surty et al.
patent: 4069498 (1978-01-01), Joshi
patent: 4092697 (1978-05-01), Spaight
patent: 4193445 (1980-03-01), Chu et al.
patent: 4254431 (1981-03-01), Babuka et al.
patent: 4462462 (1984-07-01), Meagher et al.
patent: 4498119 (1985-02-01), Cronin
patent: 4561011 (1985-12-01), Kohara et al.
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4682269 (1987-07-01), Pitasi
patent: 4794981 (1989-01-01), Mizuno
patent: 4879632 (1989-11-01), Yamamoto et al.
patent: 4965699 (1990-10-01), Jorden et al.
patent: 4974119 (1990-11-01), Martin
patent: 5012858 (1991-05-01), Natori et al.
"Structure for the Removal of Heat From an I.C. Module", by A. J. Arnold IBM TDB vol. 22 #6 Nov. 1979 pp. 2294-2295.

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