Substrate thickness measurement using oblique incidence multispe

Details Substrate thickness measurement using oblique incidence multispe Substrate thickness measurement using oblique incidence multispe

1994-09-13

1996-03-26

Turner, Samuel A.

Optics: measuring and testing

By dispersed light spectroscopy

Utilizing a spectrometer

356357, G01B 902

Patent

active

055025641

ABSTRACT:
An oblique incidence multispectral interferometric apparatus and the process of using it for measuring gross surface height errors of for measuring the total thickness of a substrate such as a semiconductor wafer or a photo mask. The instrumentation can be configured to either measure the air film between a reference flat and the substrate, or it can measure the air film on both sides of a substrate placed between reference flats. If the substrate is a flexible silicon wafer then it can be held against a known reference flat using a vacuum or other suitable means or the wafer surface can be measured from both sides in a free standing mode. In all cases the thickness map of the air space or spaces between the substrate surface or surfaces and a corresponding calibrated reference surface is measured using multispectral pattern matching.

REFERENCES:
patent: 4984894 (1991-01-01), Kondo

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