Substrate terminal areas for bonded leads

Details Substrate terminal areas for bonded leads Substrate terminal areas for bonded leads

1975-10-20

1977-07-05

Grimley, Arthur T.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29628, H05K 110

Patent

active

040341496

ABSTRACT:
A plurality of separate metallized regions on a substrate form a bondsite for a single lead to be bonded to the substrate. The metallized regions are electrically interconnected at a point removed from the bondsite. Such multiple metallized regions offer redundant bonds for each such lead to improve the mechanical strength and to improve the reliability of the bond between the lead and the substrate.

REFERENCES:
patent: 3256465 (1966-06-01), Weissenstern et al.
patent: 3418444 (1968-12-01), Ruehlemann
patent: 3528174 (1970-09-01), Harrison
patent: 3567844 (1971-03-01), Kecmar
patent: 3698073 (1972-10-01), Helda
patent: 3705047 (1972-12-01), Marriott
patent: 3834604 (1974-09-01), Fendley et al.
patent: 3841905 (1974-10-01), Dixon

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