Optical waveguides – Integrated optical circuit
Patent
1996-01-26
1997-03-11
Gensler, Paul
Optical waveguides
Integrated optical circuit
333247, 359188, 359195, 385 49, G02B 612
Patent
active
056110081
ABSTRACT:
A low-loss substrate system is provided for carrying and interconnecting optoelectronic/microwave circuits. The system includes a high-resistivity substrate, e.g., silicon of resistivity >1.times.10.sup.3 ohm-centimeter. A dielectric layer, e.g., silicon dioxide, is preferably deposited over at least a portion of the substrate. Low-loss microwave transmission members and passive microwave components, e.g., capacitors and spiral inductors, can be fabricated directly on the dielectric layer with thin-film techniques. Optoelectronic and microwave integrated circuits are preferably mounted on the substrate system with solder bumps and bonding pads. Other portions of the substrate can define grooves for receiving optical fibers. To enhance optical alignment, the grooves and bonding pads are preferably located with photolithographic techniques. The substrate system is especially suited for optoelectronic/microwave circuits that are realized with hybrid integration structures.
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Wale, Michael, J., et al., "Self-Aligned Flip-Chip Assembly of Photonic Devices with Electrical and Optical Connections", IEEE Transactions on Microwave Theory and Techniques, vol. 38, No. 5, May, 1990, pp. 518-522.
Walden, R. H., et al., "Broadband Optoelectronic Integrated Receiver Front Ends", Optical Fiber Communication 1994 Technical Digest, Paper TuH4, p. 33.
Yap, Daniel, et al., "Wideband Impedance-Matched Integrated Optoelectronic Transmitter", Integrated Optoelectronics for Communication and Processing, SPIE vol. 1582, pp. 215-222.
Jackson, K. P., et al., "A High-Density, Four Channel, OEIC Transceiver Module", Journal of Lightwave Technology, vol. 12, No. 7, Jul. 1994, pp. 1185-1190.
Denson-Low W. K.
Duraiswamy V. D.
Gensler Paul
Hughes Aircraft Company
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