Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate
2007-05-01
2007-05-01
Osele, Mark A. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
C156S583200
Reexamination Certificate
active
11001574
ABSTRACT:
There is provided a supporting plate having a structure in which a solvent can be supplied to an adhesive layer between the supporting plate and a substrate such as a semiconductor wafer in a short period of time after the substrate is thinned, and also a method for stripping the supporting plate.The supporting plate may have a larger diameter than the semiconductor wafer, and penetrating holes are formed in the supporting plate. The outer peripheral portion of the supporting plate is a flat portion in which no penetrating hole is formed. When alcohol is poured from above the supporting plate, the alcohol reaches the adhesive layer through the penetrating holes, dissolves and removes the adhesive layer.
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Blackman William D.
Carrier Joseph P.
Carrier Blackman & Associates P.C.
Osele Mark A.
Tokyo Ohka Kogyo Co. Ltd.
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