Substrate support for use in a thermal phase change ink printing

Details Substrate support for use in a thermal phase change ink printing Substrate support for use in a thermal phase change ink printing

1991-06-17

1993-09-14

Grimley, A. T.

Recorders

Record receivers and/or driving means therefor

Drum

271275, 271277, G01D 1524, G01D 1526

Patent

active

052453588

ABSTRACT:
A print drum and associated clamping assembly is provided for use in printing or similar operations. The print drum is characterized by uniform thermal characteristics and is constructed from a material having thermal diffusivity of greater than about 1.3.times.10.sup.-5 m.sup.2 /sec. The print drum may moreover have a highly reflective surface that permits optical sensors to distinguish between the drum and substrate surfaces. Clamping sections of a substrate clamp assembly project through slots provided in the print drum and are raised and lowered to release and clamp a substrate respectively. Other constituents of the clamp assembly are mounted in the hollow interior of the print drum. The print drum and associated clamping mechanism is especially suitable for use in ink jet printing apparatus utilizing thermal phase change inks.

REFERENCES:
patent: 3581257 (1971-05-01), Priessnetz
patent: 3729311 (1973-04-01), Langdon
patent: 3906512 (1975-09-01), Farlow
patent: 4607935 (1986-08-01), Kindt et al.
patent: 4947209 (1990-08-01), Maeno et al.
patent: 4947215 (1990-08-01), Chuang
patent: 4973991 (1990-11-01), Raijmahers
patent: 4982207 (1991-01-01), Tunmore et al.

Affiliated with

Also associated with

Rating

Substrate support for use in a thermal phase change ink printing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate support for use in a thermal phase change ink printing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate support for use in a thermal phase change ink printing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2030802