Substrate, substrate fabrication, semiconductor device, and...

Details Substrate, substrate fabrication, semiconductor device, and... Substrate, substrate fabrication, semiconductor device, and...

2008-07-10

2010-10-05

Brewster, William M (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S426000, C438S113000, C438S401000, C438S114000, C257S797000, C257S343000, C257S165000

Reexamination Certificate

active

07807498

ABSTRACT:
A substrate for fixing an integrated circuit (IC) element comprises: a substrate for fixing an integrated circuit element includes: a plurality of metal posts that are aligned in a longitudinal direction and a lateral direction in plan view, each of the plurality of metal posts having a first surface and a second surface facing an opposite direction to the first surface, the plurality of metal posts being configured identically; and a joining section that joins each of the plurality of metal posts together at a portion of each of the plurality of metal posts between the first surface and the second surface.

REFERENCES:
patent: 6483195 (2002-11-01), Aoki et al.
patent: 2003/0218250 (2003-11-01), Kung et al.
patent: 2004/0152234 (2004-08-01), Usui et al.
patent: 2005/0124091 (2005-06-01), Fukase et al.
patent: 2005/0166842 (2005-08-01), Sakamoto
patent: 2006/0021734 (2006-02-01), Chang et al.
patent: 2009/0072391 (2009-03-01), Kolan et al.
patent: A-2-240940 (1990-09-01), None
patent: A-2004-281486 (2004-10-01), None

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