Substrate structures for electronic devices

Metal treatment – Barrier layer stock material – p-n type – With contiguous layers of different semiconductive material

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148 33, 117950, 117952, 438479, 438493, H01L 2120

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060456264

ABSTRACT:
A substrate structure includes a single crystal Si substrate and a surface layer, with a buffer layer interleaved therebetween. The buffer layer includes at least one of an R--Zr family oxide thin film composed mainly of a rare earth oxide and/or zirconium oxide, an AMnO.sub.3 thin film composed mainly of rare earth element A, Mn and O and having a hexagonal YMnO.sub.3 type structure, an AlO.sub.x thin film composed mainly of Al and O, and a NaCl type nitride thin film composed mainly of titanium nitride, niobium nitride, tantalum nitride or zirconium nitride. The surface layer is an epitaxial film containing a wurtzite type oxide and/or nitride. The surface layer can serve as a functional film such as a semiconductor film or an underlying film therefor, and the substrate structure is useful for the manufacture of electronic devices.

REFERENCES:
Nikkei Electronics, No. 674, pp. 79 to 100, Oct. 21, 1996.
A. Watanbe, et al., Journal of Crystal Growth, vol. 128, pp. 391 to 396, "The Growth of Single Crystalline GaN on a Si Substrate Using AlN as an Intermediate Layer", 1993.
Tetsuya Takeuchi, et al., Journal of Crystal Growth, vol. 115, pp. 634 to 638, "Growth of Single Crystalline GaN Film on Si Substrate Using 3C-SiC as an Intermediate Layer", 1991.
Koji Hirosawa, et al., Electronic Communications Society, CPM92 1-13, pp. 45 to 50, "The Growth of a Single Crystalline GaN Film on a Si Substrate by MOVPE Using AlN as an Intermediate Layer", 1992 (with English Abstract).
Mizuho Morita, et al., Japanese Journal of Applied Physics, vol. 20, No. 3, pp. L173 to L175, "Aluminum Nitride Epitaxially Grown on Silicon: Orientation Relationships", Mar. 1981.

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