Substrate structure with adhesive anchoring-seams for securely a

Details Substrate structure with adhesive anchoring-seams for securely a Substrate structure with adhesive anchoring-seams for securely a

1997-02-05

1999-09-28

Jones, Deborah

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428192, 428209, 428415, 428418, 428426, 428433, 428434, 428469, 428666, 428679, 428680, 428701, 338262, 338308, 20419217, B32B 1501

Patent

active

059586060

ABSTRACT:
The present invention discloses a substrate structure for supporting a thin film with specific temperature coefficient of resistance (TCR) thereon. The substrate structure includes a substrate composed of a borosilicate glass. The substrate further includes an interface layer of LaSiONx covering a top surface of the substrate. The substrate supports the thin film includes a platinum thin film thereon. The substrate structure further includes an adhesion anchoring seam disposed as a bonding seam interfacing the thin film to the substrate for securely attaching the thin film to the substrate therein. The bonding seam is disposed on a boundary edge of the thin film and includes a nickel-chromium alloy anchor seam disposed on the boding seam. In a preferred embodiment, the substrate structure includes a protective layer covering and protecting the substrate structure thereunder. In another preferred embodiment, the substrate structure further includes electrodes for electrically connecting to the thin film with the specific TCR for providing an electrical voltage thereto.

REFERENCES:
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patent: 4649365 (1987-03-01), Furubayashi et al.
patent: 4791398 (1988-12-01), Sittler et al.
patent: 4805296 (1989-02-01), Jinda et al.
patent: 4952904 (1990-08-01), Johnson et al.
patent: 5120614 (1992-06-01), Hibner et al.
patent: 5518521 (1996-05-01), Kuo

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