Substrate structure having N-SMD ball pads

Details Substrate structure having N-SMD ball pads Substrate structure having N-SMD ball pads

2011-03-22

2011-03-22

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S779000

Reexamination Certificate

active

07911056

ABSTRACT:
A substrate structure having non-solder mask design (N-SMD) ball pads. The substrate structure includes a substrate and a solder mask. The substrate has a first surface, a trace layer and at least one ball pad. The ball pad and the trace layer are disposed on the first surface. The trace layer has a plurality of traces, and at least one trace electrically connects to the ball pad. The solder mask has at least one opening corresponding to the ball pad. The size of the opening is larger than that of the ball pad. The solder mask covers the trace connecting to the ball pad. The problem of non-alignment of the solder ball can thus be solved, and the hole in the solder ball can be prevented when the substrate structure is welded with a PCB so that the reliability of solder ball welding can be improved.

REFERENCES:
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patent: 6201305 (2001-03-01), Darveaux et al.
patent: 2002/0111054 (2002-08-01), Huang et al.
patent: 2006/0049516 (2006-03-01), Wang et al.
patent: 2006/0216860 (2006-09-01), Pendse
patent: 07038231 (1995-02-01), None
patent: 08-230346 (1996-09-01), None

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