Substrate spin treating method and apparatus

Details Substrate spin treating method and apparatus Substrate spin treating method and apparatus

1996-10-11

1998-08-04

Edwards, Laura

Coating apparatus

Projection or spray type

Rotating turret work support

118320, 118 52, 134902, 134154, 134153, B05B 1304, B08B 300

Patent

active

057887730

ABSTRACT:
A baffle is placed in a position opposed to discharge openings of a treating solution supply nozzle and between the discharge openings and the surface of a substrate. The baffle intercepts a treating solution discharged from the discharge openings, whereby the treating solution is supplied evenly to the surface of the substrate by flowing over a surface of the baffle and falling from an edge of the baffle to the substrate, instead of falling from the discharge openings directly to the substrate. No microbubbles are formed in the treating solution on the substrate, which would cause an unevenness of treatment. The discharge openings may be defined by a plurality of circular bores formed in the supply nozzle. Each circular bore may have a diameter at least equal to a spacing between an adjacent pair of circular bores.

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