Fishing – trapping – and vermin destroying
Patent
1987-10-23
1989-05-09
Hearn, Brian E.
Fishing, trapping, and vermin destroying
148DIG3, 148DIG65, 148DIG110, 148DIG12, 148 333, 156612, 156DIG68, 428627, 437107, 437 95, 437180, 437245, 437247, 437902, 437925, H01L 3104
Patent
active
048290203
ABSTRACT:
During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.
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Drummond Timothy J.
Ginley David S.
Zipperian Thomas E.
Bunch William
Chafin James H.
Hearn Brian E.
Hightower Judson R.
Libman George H.
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