Substrate sheet material for a semiconductor device and a...

Details Substrate sheet material for a semiconductor device and a... Substrate sheet material for a semiconductor device and a...

2007-01-02

2007-01-02

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S112000, C438S113000, C438S127000, C438S460000

Reexamination Certificate

active

10718677

ABSTRACT:
A substrate sheet material for semiconductor device and manufacturing method thereof and a manufacturing method of a semiconductor device using the substrate sheet material can suppress and reduce a warp which may occur in the substrate sheet material even when a plurality of semiconductor chips formed in the substrate sheet material are molded all at once. A plurality of substrates to be used for producing semiconductor packages are formed in the substrate sheet material. An outer configuration of the substrate sheet material is made into a circular shape.

REFERENCES:
patent: 6537482 (2003-03-01), Farnworth
patent: 6676885 (2004-01-01), Shimizu et al.
patent: 6965160 (2005-11-01), Cobbley et al.
patent: 10-79362 (1998-03-01), None
patent: 2000-12745 (2000-01-01), None
patent: 2002-110718 (2002-04-01), None

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