Severing by tearing or breaking – Methods
Patent
1978-09-11
1980-11-25
Yost, Frank T.
Severing by tearing or breaking
Methods
225 2, 225 965, 225 97, 225103, B26F 300
Patent
active
042353572
ABSTRACT:
A machine and method for subdividing into individual substrates a wafer which is prescored with a pattern of intersecting score lines defining the substrates. The wafer is progressively directed over a first wafer-engaging surface substantially paralleling one set of score lines, and this surface cooperates during a breaking operation to impart a localized force at a score line in the set. The wafer is halted during the breaking operation, after which the broken-off portion is directed over a second wafer-engaging surface substantially paralleling the other set of score lines. This second surface cooperates, during a substrate breaking operation, to apply a localized force adjacent a score line of the other set. The broken-off portion is halted during this latter breaking operation at which a substrate is separated from the broken-off portion of the wafer.
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MTI Systems Corporation
Yost Frank T.
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