Substrate retaining ring for CMP

Details Substrate retaining ring for CMP Substrate retaining ring for CMP

2006-10-12

2009-10-06

Rose, Robert (Department: 3727)

Abrading

Machine

Rotary tool

C451S398000, C451S442000

Reexamination Certificate

active

07597609

ABSTRACT:
The edge effect or variation in polishing edge profile on a substrate undergoing CMP is reduced by structuring a retaining ring, housed in a carrier head for retaining the substrate, such that the polishing edge profile shifts back and forth with respect to the center of the substrate. Embodiments include structuring the retaining ring such that the width between inner and outer surfaces varies by an amount sufficient to compensate for polishing edge profile variation. Embodiments also include structuring the retaining ring such that the distance from the outer surface to the geometric inner surface varies. Embodiments further include structuring the retaining ring such that the distance between the outer surface to the perimeter of the substrate retained by the inner surface of the retaining ring varies.

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