Substrate processing system, substrate processing method,...

Details Substrate processing system, substrate processing method,... Substrate processing system, substrate processing method,...

2007-02-06

2010-02-02

Gravini, Stephen M. (Department: 3743)

Drying and gas or vapor contact with solids

Process

Gas or vapor contact with treated material

C034S499000, C034S078000, C034S080000, C034S090000, C034S210000, C118S065000, C118S715000

Reexamination Certificate

active

07654010

ABSTRACT:
A substrate processing method for a substrate processing system comprising at least a substrate processing apparatus that subjects a substrate to processing, and a substrate transferring apparatus having a transferring device that transfers the substrate, which enables the yield to be increased without bringing about a decrease in the throughput. The substrate processing method comprises a jetting step of jetting a high-temperature gas onto at least one of the transferring device and the substrate transferred by the transferring device.

REFERENCES:
patent: 3683848 (1972-08-01), Plumat et al.
patent: 3857682 (1974-12-01), White
patent: 4221956 (1980-09-01), Fielding et al.
patent: 4339508 (1982-07-01), Tsuya et al.
patent: 4424176 (1984-01-01), Shirley et al.
patent: 4721556 (1988-01-01), Hsu
patent: 4728353 (1988-03-01), Thomas et al.
patent: 4817652 (1989-04-01), Liu et al.
patent: 4836858 (1989-06-01), Reinhart
patent: 4878934 (1989-11-01), Thomas et al.
patent: 4917717 (1990-04-01), Thomas et al.
patent: 4962776 (1990-10-01), Liu et al.
patent: 4967686 (1990-11-01), Mottet et al.
patent: 5025597 (1991-06-01), Tada et al.
patent: RE34213 (1993-04-01), Hsu
patent: 5204517 (1993-04-01), Cates et al.
patent: 5211985 (1993-05-01), Shirley et al.
patent: 5212496 (1993-05-01), Badesha et al.
patent: 5328517 (1994-07-01), Cates et al.
patent: 5356674 (1994-10-01), Henne et al.
patent: 5366156 (1994-11-01), Bauer et al.
patent: 5400603 (1995-03-01), Bauer et al.
patent: 5502476 (1996-03-01), Neal et al.
patent: 5518542 (1996-05-01), Matsukawa et al.
patent: 5527389 (1996-06-01), Rosenblum et al.
patent: 5548907 (1996-08-01), Gourdine
patent: 5621022 (1997-04-01), Jaeger et al.
patent: 5627578 (1997-05-01), Weintraub
patent: 5652044 (1997-07-01), Rickerby
patent: 5653045 (1997-08-01), Ferrell
patent: 5656096 (1997-08-01), Van Alstyne
patent: 5660047 (1997-08-01), Paganessi
patent: 5678752 (1997-10-01), Kaminsky et al.
patent: 5720818 (1998-02-01), Donde et al.
patent: 5782253 (1998-07-01), Cates et al.
patent: 5789755 (1998-08-01), Bender
patent: 5846338 (1998-12-01), Bonora et al.
patent: 5902841 (1999-05-01), Jaeger et al.
patent: 5914091 (1999-06-01), Holst et al.
patent: 5964954 (1999-10-01), Matsukawa et al.
patent: 5983906 (1999-11-01), Zhao et al.
patent: 6027766 (2000-02-01), Greenberg et al.
patent: 6028316 (2000-02-01), Bender
patent: 6073366 (2000-06-01), Aswad
patent: 6108189 (2000-08-01), Weldon et al.
patent: 6165555 (2000-12-01), Jun et al.
patent: 6183558 (2001-02-01), Otake et al.
patent: 6195505 (2001-02-01), Van Alstyne
patent: 6203617 (2001-03-01), Tanoue et al.
patent: 6207005 (2001-03-01), Henley et al.
patent: 6248399 (2001-06-01), Hehmann
patent: 6249132 (2001-06-01), Amemiya
patent: 6284055 (2001-09-01), Dryer et al.
patent: 6290804 (2001-09-01), Henley et al.
patent: 6322626 (2001-11-01), Shirley
patent: 6327994 (2001-12-01), Labrador
patent: 6344084 (2002-02-01), Koinuma et al.
patent: 6362044 (2002-03-01), Shimizu et al.
patent: 6408537 (2002-06-01), Aswad
patent: 6432824 (2002-08-01), Yanagisawa
patent: 6451118 (2002-09-01), Garriga
patent: 6464789 (2002-10-01), Akimoto
patent: 6474986 (2002-11-01), Oda et al.
patent: 6492309 (2002-12-01), Behr et al.
patent: 6578287 (2003-06-01), Aswad
patent: 6589889 (2003-07-01), Endisch et al.
patent: 6598314 (2003-07-01), Kuo et al.
patent: 6613678 (2003-09-01), Sakaguchi et al.
patent: 6677167 (2004-01-01), Kanno et al.
patent: 6690004 (2004-02-01), Miller et al.
patent: 6721162 (2004-04-01), Weldon et al.
patent: 6797607 (2004-09-01), Endisch et al.
patent: 6821501 (2004-11-01), Matzakos et al.
patent: 6821819 (2004-11-01), Benavides et al.
patent: 6827435 (2004-12-01), Domoto et al.
patent: 6881687 (2005-04-01), Castrucci
patent: 6936134 (2005-08-01), Yonemizu et al.
patent: 6938815 (2005-09-01), Li
patent: 6949389 (2005-09-01), Pichler et al.
patent: 6949403 (2005-09-01), Xiao et al.
patent: 7122095 (2006-10-01), Letertre et al.
patent: 7138016 (2006-11-01), Reardon et al.
patent: 7220365 (2007-05-01), Qu et al.
patent: 7267725 (2007-09-01), Kawano
patent: 7293570 (2007-11-01), Jackson
patent: 7402277 (2008-07-01), Ayer et al.
patent: 7404870 (2008-07-01), Letertre et al.
patent: 7413611 (2008-08-01), Iizuka
patent: 2001/0015737 (2001-08-01), Truninger et al.
patent: 2002/0056519 (2002-05-01), Henley et al.
patent: 2003/0183306 (2003-10-01), Hehmann et al.
patent: 2004/0003828 (2004-01-01), Jackson
patent: 2004/0182416 (2004-09-01), Allen et al.
patent: 2004/0206444 (2004-10-01), Letertre et al.
patent: 2005/0016462 (2005-01-01), Yamazaki
patent: 2006/0124156 (2006-06-01), Jackson
patent: 2006/0231203 (2006-10-01), Letertre et al.
patent: 2006/0233965 (2006-10-01), Boulos et al.
patent: 2006/0278254 (2006-12-01), Jackson
patent: 2007/0193062 (2007-08-01), Moriya et al.
patent: 2008/0047585 (2008-02-01), Moriya
patent: 2008/0181750 (2008-07-01), Moriya et al.
patent: 2008/0223399 (2008-09-01), Onishi
patent: 2008/0223400 (2008-09-01), Onishi et al.
patent: 2008/0236629 (2008-10-01), Sugawara et al.
patent: 2008/0236634 (2008-10-01), Moriya et al.
patent: 2008/0245390 (2008-10-01), Freer et al.
patent: 2009/0056741 (2009-03-01), Iida et al.
patent: 05185596 (1993-07-01), None

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