Substrate processing system and method of controlling the same

Details Substrate processing system and method of controlling the same Substrate processing system and method of controlling the same

2011-07-26

2011-07-26

Jolley, Kirsten C (Department: 1715)

Coating processes

Centrifugal force utilized

C427S425000, C118S683000, C118S684000, C118S052000, C118S313000, C239S001000

Reexamination Certificate

active

07985448

ABSTRACT:
A process system includes a plurality of processing modules each processing a substrate with a process liquid. There is disposed a dispensing mechanism that dispenses the process liquid to the vertically arranged modules. The dispensing mechanism is provided with a process liquid supply source, and pumps corresponding to the respective processing modules. Each pump temporarily stores therein the process liquid which has been pressure-fed through a riser piping from the process liquid supply source by a pressing apparatus, and delivers the process liquid from an outlet. There are disposed nozzles each having a discharge port and discharging the process liquid to the corresponding processing module. Delivery pipings connecting the outlets of the pumps with the discharge ports of the corresponding nozzles have identical length to each other.

REFERENCES:
patent: 6183147 (2001-02-01), Kimura et al.
patent: 6391111 (2002-05-01), Fujimoto et al.
patent: 6530340 (2003-03-01), You et al.
patent: 6848625 (2005-02-01), Takekuma et al.
patent: 2004/0094087 (2004-05-01), Ivanov et al.
patent: 2000-235949 (2000-08-01), None

Affiliated with

Also associated with

Rating

Substrate processing system and method of controlling the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing system and method of controlling the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing system and method of controlling the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2636858